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Part No.	Density	Serial Interface	ECC	Max Frequency	Vcc Range	Packages	Grade	Status
HF25G01B	1Gbit	SPI, Dual SPI, Quad SPI	8bit	108MHz	2.7V-3.6V	DND, BGB	G	M
HF25LG01B	1Gbit	SPI, Dual SPI, Quad SPI	8bit	88MHz	1.7V-1.95V	DND	G	N
HF25S01	1Gbit	SPI, Dual SPI, Quad SPI	1bit	104MHz	2.7V-3.6V	DND	G	M
HF25S01A	1Gbit	SPI, Dual SPI, Quad SPI	1bit	104MHz	2.7V-3.6V	DND	G	M
HF25LS01	1Gbit	SPI, Dual SPI, Quad SPI	1bit	50MHz	1.7V-1.95V	DND	G	S
HF25G02	2Gbit	SPI, Dual SPI, Quad SPI	4bit	108MHz	2.7V-3.6V	DND, BGB	G	M
HF25G02B	2Gbit	SPI, Dual SPI, Quad SPI	8bit	108MHz	2.7V-3.6V	DND, BGB	G	M
HF25LG02B	2Gbit	SPI, Dual SPI, Quad SPI	8bit	88MHz	1.7V-1.95V	DND	G	M
HF25G02C	2Gbit	SPI, Dual SPI, Quad SPI	4bit	88MHz	2.7V-3.6V	DND, BGB	G	M
HF25S02	2Gbit	SPI, Dual SPI, Quad SPI	1bit	104MHz	2.7V-3.6V	DND	G	UD
HF25LS02	2Gbit	SPI, Dual SPI, Quad SPI	1bit	50MHz	1.7V-1.95V	DND	G	UD
HF25G04C	4Gbit	SPI, Dual SPI, Quad SPI	4bit	88MHz	2.7V-3.6V	DND, BGB	G	S

● Package: PD=PDIP8, SO=SOP8(150mil) or SOP14, SOB=SOP8(208mil), TS=TSSOP8 or TSSOP14, MS=MSOP8, VSA=VSOP8(150mil), UN=UDFN(2*3), DN=TDFN8(2*3), US=USON8(2*3), SN=USON(0.45mm), DNA=TDFN8(5*6), DND=TDFN(6*8), ST=TSOT23-5L or TSOT23-6L, BGB=BGA24(6*8), CSP=WLCSP, QND=QFN16, TP=TSOP48

● Status: M= Mass Production, S=Samples, UD=Under Development, N=Not recommended for new designs.

Device Grade Description

G -40 to 85℃, Industrial Grade, RoHS&REACH compliant.

A1 -40 to 125℃, Automotive Grade 1, RoHS&REACH compliant.

A2 -40 to 105℃, Automotive Grade 2, RoHS&REACH compliant.

E0/E1/E2 Extended Temperature Ranges, contact sales for detail.

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備案編號(hào)：粵ICP備17043872號(hào)

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